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IPP’s Cool Chip IPP-CCN1010-40 is designed to draw heat from one location that is too hot and move it to a different location that can absorb the heat. This device is manufactured on a highly thermally conductive ceramic substrate (Aluminum Nitride) that is electrically isolated and safe to use. The terminals are gold-plated over nickel, making them easy to solder with many different alloy types. This device is ideal for small, compact areas with high heat concentrations, intended for both military and commercial applications. Cool Chips are made in the USA with the same high quality that IPP is known for. Applications include RF Amplifiers, Capacitors, Transistors, Power Supplies, Filters, Resistors, PIN and Laser Diodes.
