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IPP’s Cool Chip Thermal Bridge IPP-CCN1010-40N is designed to draw heat from one location that is too hot and move it to a different location that can absorb the heat. These devices are manufactured on a highly thermally conductive ceramic substrate (Aluminum Nitride) that is electrically isolated and safe to use. The terminals are gold-plated over nickel, making them easy to solder with many different alloy types. These devices are ideal for small, compact areas with high heat concentrations, intended for both military and commercial applications. Applications include Resistors, PIN and Laser Diodes, Filters, Power Supplies, Transistors, Capacitors, and RF Amplifiers.
